CERAMIC PACKAGES

Addison Semiconductor Materials stocks over 3.5 million ceramic packages and in excess of one-million metal alloy lids. These include side braze, pin grid array, leadless/leaded chip carriers, flatpacks, headers, cerdip, cerpac. Our large inventory allows you to select from a variety of different configurations. The packages are Kyocera and NTK manufactured. The lids are gold plated and have gold-tin eutectic preforms attached. We specialize in both small and large orders and can typically ship within 24 hours.

Addison Semiconductor Materials can also handle your assembly requirements. We provide fast turn assembly services, from precision wafer dicing, through die attach, wire bond, and seal plus test and burn-in. Our staff can free up your valuable engineering resources by taking your assembly from prototype through full production volumes.