Silicon Wafer Processing

SILICON WAFER PROCESSING

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Addison Semiconductor Materials has an extensive array of processing capabilities. On our silicon or yours, we can provide virtually any processing service you may need, from a simple oxide layer to completely patterned wafers. All of the services listed below are available, from developmental lots to full production runs. Our goal is to provide our customer with the highest quality processing at competitive pricing. Whether you are a fabless company, need a specific process infrequently, or just need some extra capacity, let our staff unburden your process engineers.

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A stack of disks is sitting inside of a machine.
  • Oxide
    • Thermal oxide
    • TEOS/PETEOS oxide
    • Gate oxide
    • Low temperature oxide
    • PSG glass
  • Silicon Nitride
    • LPCVD
    • Low Stress
    • Ultra-low Stress
A person is holding a magnifying glass in front of a lamp.
  • Polysilicon (undoped)
  • Metal deposition: evaporation, sputter
  • Epitaxial deposition
  • Ion implantation
  • SOI (oxidation, wafer bonding)
  • Photolithography
  • Photoresist: coat, strip
  • Clean: RCA clean
  • Mechanical:
  • Ingot slicing
  • Lap & etch
  • Wafer thinning
  • Wafer downsize (diameter cut-down)
  • Wafer dicing
  • Wafer reclaim
  • Laser marking
  • Wafer bumping
  • MEMS - Silicon machining
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